DuPont offers organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces through our EKC Technology portfolio.
EKC800™
EKC800™ is designed to remove positive photoresist that has experienced standard processing with normal thermal history.
EKC830™
EKC830™ is designed to effectively remove positive photoresist resulting from harsh prior processing that is difficult to remove.
EKC865™
EKC865™ is specifically formulated to prevent attack of sensitive metals. It will remove positive photoresist with normal thermal history.
EKC922™
EKC922™ is used to remove photoresist over cured or semi-cured polyimide without attack.
Organic materials specifically formulated to remove positive & negative photoresist from substrate surfaces
Aqueous & semi-aqueous organic mixtures formulated to effectively remove residues from substrate surfaces after via, poly and metal etch processes.
View DetailsEnable removal of positive- and negative-tone photoresists as well as plasma-hardened residues, and which are compatible with a wide variety of metals required to form LED contacts
View DetailsPost-Clean treatments are specifically formulated for use after post etch residue or photoresist removal and prior to the DI water rinse step.
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